Capabilities

We leave nothing to chance and build our reputation on our expertise and core competencies. Our highly experienced engineers provide all the required capabilities to design the most innovative products (routing, diagrams, thermo-mechanical and simulation).

Our process

All the skills to design and support High-Performance Embedded Computers (HPEC)

Interface Concept develops in-house unique and original products that are relevant to system integrators looking for high performance and reliable global solutions. This product offering is backed by an effective and relevant technical support, enabling integrators to focus on their core business while reducing their time-to-market.

Interface Concept is deeply involved in all the system development stages, from specification analysis to product life cycle management. Each step of the board design process, from hardware, software, and BIOS, is performed and managed in house by a highly qualified engineering team, with a long established expertise in embedded technologies, to deliver the best solutions to customers.

  1. Specification Analysis
    Strive to understand our customers’ needs, requirements and challenges by working closely with them.
  2. Architecture Proposal
    Propose an optimized and competitive solution based on an existing product (COTS), a customized existing product (MCOTS) or a fully customized product.
  3. Hardware and Software Design
    Ensure design quality, leveraging the industry’s best practices and Interface Concept’s highly skilled Engineering team.
  4. Communication and Processing Building Blocks
    Offer a comprehensive product range that includes all the basic bricks of an embedded system: SBC/DSP, FEP, Switch, I/O boards, with firmware and IP cores.
  1. Specification Analysis
    Strive to understand our customers’ needs, requirements and challenges by working closely with them.
  2. Architecture Proposal
    Propose an optimized and competitive solution based on an existing product (COTS), a customized existing product (MCOTS) or a fully customized product.
  3. Hardware and Software Design
    Ensure design quality, leveraging the industry’s best practices and Interface Concept’s highly skilled Engineering team.
  4. Communication and Processing Building Blocks
    Offer a comprehensive product range that includes all the basic bricks of an embedded system: SBC/DSP, FEP, Switch, I/O boards, with firmware and IP cores.
  1. Prototype Integration and Qualification
    Help our customer reduce time-to-market by offering product prototypes for integration and qualification.
  2. Support
    Leveraging Interface Concept’s highly skilled engineering team, provide technical support to our customers throughout system development and deployment.
  3. Life Cycle
    Secure our product long-term availability with a strong supervision of our suppliers and the semi-conductor market.

Resources to manufacture quality state-of-the-art COTS and custom products

Components and PCB are provisioned from approved manufacturers according to bill of materials.

Boards are assembled and manufactured according to a qualified and well-established process, compliant with IPC-A-610 Class 3 Standard.

Boards are controlled further to each manufacturing process step.

Each board is functionally tested according to a qualified and proven test process.

Further to the coating process and mechanical part set-up, each board undergoes environmental screening test complying with the board grade specification (on request).

Our certificates

Interface Concept is certified to the ISO 9001:2015 standards.
Interface Concept is an approved #joscar supplier for UK Aerospace, Defence and Security sectors.

IP FPGA Cores

Interface Concept delivers a comprehensive array of IP Cores optimized for IC boards with on-board FPGA devices.

Together with its COTS Single Board Computers and FPGA boards, Interface Concept supplies a comprehensive range of FPGA IP cores intending to provide innovative technical responses to applications requiring specific functions:

  • PCI Express to VME bridge
  • IP DMA
  • SFPDP – Serial Front Panel Data Port
  • HDLC – High-Level Data Link Control
  • ARINC 818
  • L2 Gigabit Ethernet switch

These IP cores are developed and supported by Interface Concept’s highly skilled FPGA engineers.

PCIe CORE
1.2 Switch Manager

Our resources

To comply with the most stringent requirements of today’s HPEC market, Interface Concept has developed expertise in thermomechanical simulation and signal integrity simulation/analysis. With this know-know, Interface Concept has the capacity to develop and test extremely complex & very high-density boards and systems:

Development Software:

  • PCB CAD Suite from Mentor
  • Keysight ADS

Measuring equipment and instruments:

  • High-Performance Oscilloscopes
  • Digital and analog signal analysers
  • Spirent Test Center
  • 45 GHz vector network analyzer (VNA)
  • High-performance signal generators

Simulation tools:

  • High-speed digital/analog design: Keysight ADS SI/PI Pro – Momentum
  • Coupled Thermal and CFD computation software : 6SigmaET from Future Facilities
Interface Concept supplies a full set of development tools and highly responsive technical support, to build successful solutions:
BSP for Linux, VxWorks…
Bootloader and optimized drivers for all the devices on our SBCs and DSPs
FPGA Firmware
A FPGA development kit with firmware, VHDL for system services and Example Designs
MULTIWARE
A full set of software tools providing a high level abstraction of the hardware dedicated to inter processor, memory and board communications
SWITCHWARE
In-house management software for switches and routers

Our grades

(*) Temperature grades are subject to availability according to IC products. Please consult us.
StandardExtendedRuggedConduction-cooled 71°CConduction-cooled 71°C
CoatingOptionalYesYesYesYes
Operat. Temp.0 to 55°C-20 to 65°C-40°C to 71°C (*)-40°C to 71°C at the thermal interface (*)-40°C to 85°C at the thermal interface (*)
Rec. airflow1 .. 2 m/s2 .. 3 m/s2 .. 5 m/s--
Oper. HR% no cond.5 to 90%5 to 95%5 to 95%5 to 95%5 to 95%
Storage Temp.-45°C to 85°C-45°C to 85°C-45°C to 100°C-45°C to 100°C-45°C to 100°C
Sinusoidal Vibr2G [20..2000]Hz2G [20..2000]Hz5G [20..2000]Hz5G [20..2000]Hz5G [20..2000]Hz
Random Vibr0.002g2 /Hz [10..2000]Hz0.002g2 /Hz [10..2000]Hz0.05g2 /Hz [10..2000]Hz0.1g2 /Hz [10..2000]Hz0.1g2 /Hz [10..2000]Hz
Shock 1/2 Sin. 11ms20G20G40G40G40G
StandardExtendedRuggedConduction-cooled 71°CConduction-cooled 71°C
CoatingOptionalYesYesYesYes
Operat. Temp.0 to 55°C-20 to 65°C-40°C to 71°C (*)-40°C to 71°C at the thermal interface (*)-40°C to 85°C at the thermal interface (*)
Rec. airflow1 .. 2 m/s2 .. 3 m/s2 .. 5 m/s--
Oper. HR% no cond.5 to 90%5 to 95%5 to 95%5 to 95%5 to 95%
Storage Temp.-45°C to 85°C-45°C to 85°C-45°C to 100°C-45°C to 100°C-45°C to 100°C
Sinusoidal Vibr2G [20..2000]Hz2G [20..2000]Hz5G [20..2000]Hz5G [20..2000]Hz5G [20..2000]Hz
Random Vibr0.002g2 /Hz [10..2000]Hz0.002g2 /Hz [10..2000]Hz0.05g2 /Hz [10..2000]Hz0.1g2 /Hz [10..2000]Hz0.1g2 /Hz [10..2000]Hz
Shock 1/2 Sin. 11ms20G20G40G40G40G
(*) Temperature grades are subject to availability according to IC products. Please consult us.