Array ( [0] => stdClass Object ( [id] => 1 [img_process] => HPEC-diagram_2022-03-24.jpg [process_img1] => capabilities1.jpg [process_img2] => capabilities2.jpg [process_img3] => capabilities3.jpg [process_img4] => capabilities4.jpg [img_certificate1] => ISO2001-2015_FR.jpg [img_certificate2] => ISO2001-2015_UK.jpg [fpga_cores_img] => fpga.png [resources_img1] => resource1-2.jpg [resources_img2] => resource1.jpg ) [1] => stdClass Object ( [id] => 2 [img_process] => [process_img1] => [process_img2] => [process_img3] => [process_img4] => [img_certificate1] => JOSCAR_Certificate.jpg [img_certificate2] => JOSCAR_Certificate.jpg [fpga_cores_img] => [resources_img1] => [resources_img2] => ) [2] => stdClass Object ( [id] => 3 [img_process] => [process_img1] => [process_img2] => [process_img3] => [process_img4] => [img_certificate1] => [img_certificate2] => [fpga_cores_img] => [resources_img1] => [resources_img2] => ) )
This website uses cookies for audience measurements. By clicking on “I accept”, you agree our cookies policy. Learn more I accept
All the skills to design and support High-Performance Embedded Computers (HPEC)
Interface Concept develops in-house unique and original products that are relevant to system integrators looking for high performance and reliable global solutions. This product offering is backed by an effective and relevant technical support, enabling integrators to focus on their core business while reducing their time-to-market. Interface Concept is deeply involved in all the system development stages, from specification analysis to product life cycle management. Each step of the board design process, from hardware, software, and BIOS, is performed and managed in house by a highly qualified engineering team, with a long established expertise in embedded technologies, to deliver the best solutions to customers.
Components and PCB are provisioned from approved manufacturers according to bill of materials.
Boards are assembled and manufactured according to a qualified and well-established process, compliant with IPC-A-610 Class 3 Standard.
Boards are controlled further to each manufacturing process step.
Each board is functionally tested according to a qualified and proven test process.
Further to the coating process and mechanical part set-up, each board undergoes environmental screening test complying with the board grade specification (on request).
Interface Concept delivers a comprehensive array of IP Cores optimized for IC boards with on-board FPGA devices.
Together with its COTS Single Board Computers and FPGA boards, Interface Concept supplies a comprehensive range of FPGA IP cores intending to provide innovative technical responses to applications requiring specific functions:
These IP cores are developed and supported by Interface Concept's highly skilled FPGA engineers.
To comply with the most stringent requirements of today’s HPEC market, Interface Concept has developed expertise in thermomechanical simulation and signal integrity simulation/analysis. With this know-know, Interface Concept has the capacity to develop and test extremely complex & very high-density boards and systems:
Bootloader and optimized drivers for all the devices on our SBCs and DSPs
A FPGA development kit with firmware, VHDL for system services and Example Designs
A full set of software tools providing a high level abstraction of the hardware dedicated to inter processor, memory and board communications
In-house management software for switches and routers
Criterion | Standard | Extended | Rugged | Conduction-cooled 71°C | Conduction-cooled 85°C |
Coating | Optional | Yes | Yes | Yes | Yes |
Operat. Temp. | 0 to 55°C | -20 to 65°C | -40°C to 71°C or 85°C (*) | -40°C to 71°C at the thermal interface (*) |
-40°C to 85°C at the thermal interface (*) |
Rec. airflow | 1 .. 2 m/s | 2 .. 3 m/s | 2 .. 5 m/s | - | - |
Oper. HR% no cond. | 5 to 90% | 5 to 95% | 5 to 95% | 5 to 95% | 5 to 95% |
Storage Temp. | -45°C to 85°C | -45°C to 85°C | -45°C to 100°C | -45°C to 100°C | -45°C to 100°C |
Sinusoidal Vibr | 2G [20..2000]Hz | 2G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz |
Random Vibr | 0.002g2 /Hz [10..2000]Hz |
0.002g2 /Hz [10..2000]Hz |
0.05g2 /Hz [10..2000]Hz |
0.1g2 /Hz [10..2000]Hz |
0.1g2 /Hz [10..2000]Hz |
Shock 1/2 Sin. 11ms | 20G | 20G | 40G | 40G | 40G |